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Título: Exploring Instruction Fusion Opportunities in General Purpose Processors
Fecha de publicación: 18-dic-2023
Editorial: IEEE Press
Cita bibliográfica: MICRO '22: Proceedings of the 55th Annual IEEE/ACM International Symposium on MicroarchitectureOctober 2022 Pages 199–212
ISBN: 978-1-6654-6272-3
Palabras clave: General purpose processors
Microarchitecture
Instruction fusion
Resumen: The Complex Instruction Set Computer (CISC) paradigm has led to the introduction of instruction cracking in which an architectural instruction is divided into multiple microarchitectural instructions (μ-ops). However, the dual concept, instruction fusion is also prevalent in modern microarchitectures to maximize resource utilization. In essence, some architectural instructions are too complex to be executed as a unit, so they should be cracked, while others are too simple to waste resources on executing them as a unit, so they should be fused with others. In this paper, we focus on instruction fusion and explore opportunities for fusing additional instructions in a high- performance general purpose pipeline. We show that enabling fusion for common RISC-V idioms improves performance by 7%. Then, we determine experimentally that enabling fusion only for memory instructions achieves 86% of the potential of fusion in this particular case. Finally, we propose the Helios microarchitecture, able to fuse non-consecutive and non-contiguous memory instructions, and discuss microarchitectural changes required to do so efficiently while preserving correctness. Helios allows to fuse an additional 5.5% of dynamic instructions, yielding a 14.2% performance uplift over no fusion (8.2% over baseline fusion).
Autor/es principal/es: Singh, Sawan
Perais, Arthur
Jimborean, Alexandra
Ros, Alberto
Facultad/Departamentos/Servicios: Facultades, Departamentos, Servicios y Escuelas::Departamentos de la UMU::Ingeniería de la Información y las Comunicaciones
Forma parte de: 55th International Symposium on Microarchitecture (MICRO)
URI: http://hdl.handle.net/10201/124785
DOI: https://doi.org/10.1109/MICRO56248.2022.00026
Tipo de documento: info:eu-repo/semantics/article
Número páginas / Extensión: 14
Derechos: info:eu-repo/semantics/openAccess
Atribución 4.0 Internacional
Attribution-NonCommercial-NoDerivatives 4.0 Internacional
Descripción: © 2023. IEEE. This document is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0 This document is the accepted version of a published work that appeared in final form in MICRO '22: Proceedings of the 55th Annual IEEE/ACM International Symposium on Microarchitecture To access the final work, see DOI: https://doi.org/10.1109/MICRO56248.2022.00026
Aparece en las colecciones:Artículos: Ingeniería y Tecnología de Computadores

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